A Vertically Integrated Approach to Sapphire Production

One of the things we take pride in at Rubicon Technology is our end-to-end manufacturing capabilities.

By having state-of-the-art facilities that support vertical integration, starting with the raw material aluminum oxide, we’re able to eliminate excess costs for our customers, and provide greater quality control to ensure the delivery of defect-free sapphire with diameters of 2, 4, 6, and soon, 8 inches.

This ultimately benefits LED chip manufacturers since high-quality, large-diameter wafers provide a higher yield and reduce costs of LEDs for commercial and residential use. Improved cost and luminous efficiency are fundamental to the acceleration of LED adoption in the marketplace — and continue to be strategic priorities for Rubicon.

The infographic below explains the basics of the six-step process of transforming sapphire into an LED module. Rubicon carries out steps 1 through 4 of the process — from crystal growth to wafer processing — before turning over to LED chip manufacturers.

We should also note that Rubicon recently started providing patterned sapphire substrates (PSS) to increase the LEDs’ light output by up to 30 percent. PSS is added directly prior to the epitaxial growth process.

The latter part of the process, after drilling, is primarily carried out in Rubicon’s facility in Malaysia. This facility enables Rubicon to reduce costs associated with making a 6-inch wafer.

For more info on the benefits of a vertically integrated approach, check out pages 50-55 of Compound Semiconductor’s March 2013 edition.

Rubicon Announces Large Diameter Patterned Sapphire Substrates

PSS with dome shape

PSS with dome shape


This week, Rubicon Technology announced the launch of the first commercial line of large diameter patterned sapphire substrates (PSS) in four-inch through eight-inch diameters.  The new product line provides LED chip manufacturers with a ready-made source of large diameter PSS to serve the needs of the rapidly growing LED general lighting industry.

This is doubly important since patterning helps improve both epitaxial growth and light extraction for each chip and enhances a chipmaker’s throughput and efficiency.  Rubicon announced that they have fully customizable sub-micron patterning capability with tight dimensional tolerances, within ±0.1 µm.  Rubicon offers LED chip manufacturers more usable area to maximize the number of chips per wafer due to an edge exclusion zone as small as 1 mm.  Rubicon’s patterning is available in a range of shapes including cone, dome and pyramid, and in a range of orientations.  Further customization of geometry, pattern and orientation is available too.  You can find a brochure about it on Rubicon’s web site here.

Rubicon’s president and CEO Raja Parvez pointed out the importance of large diameter patterned sapphire substrates in a news release.  “As LED-based general lighting gains worldwide adoption, large-diameter patterned sapphire substrates will become necessary to meet the demands of the rapidly growing lighting market.”

Parvez added that the company developed an unmatched technology platform that is vertically integrated from raw material through crystal growth, large diameter polished wafers, and now custom PSS in 4”, 6” and 8” diameters.  According to Parvez, vertical integration enables Rubicon to produce progressively larger sapphire products while providing customers with exceptional quality, cost control, reliability, and consistency.

For Further Reading

Rubicon Technology, Rubicon Technology Launches First Commercial Line of Large Diameter Patterned Sapphire Substrates for the LED Industry, http://bit.ly/1itVMHq

Clearlysapphire.com, LED Lighting Spotlight: Patterned Sapphire Substrates, http://blog.clearlysapphire.com/?p=390


Commercial Sapphire Spotlight – Vertical Integration in Sapphire

Rubicon Family of Sapphire Boules

Last month, Compound Semiconductor Magazine featured a contributed article about Vertical Integration in sapphire production by Raja M. Parvez, President and CEO of Rubicon Technology.  Rubicon has adopted vertical integration to set itself apart from other sapphire companies.  The article details Rubicon’s approach.

Vertical integration isn’t a new concept. It has been around since the 1800s when US Steel tycoon Andrew Carnegie introduced the vertical integration by owning virtually every part of the steel-making value chain from iron ore through steel mills to physically building the railroads.  Later, in the 1920s, Ford Motor Company decided to make the steel for their cars, popularizing the concept further.

According to Rubicon’s president and CEO Raja Parvez, vertical integration holds the key to Rubicon’s cost structure and reliable supply of high-quality products.  This integrated approach influences every step in the growth of sapphire crystals and their processing into wafers. The company’s end-to-end manufacturing capability, with strong intellectual property at each step of the manufacturing process, produces an advantageous cost structure and provides better control of product quality and delivery schedules. Vertical integration is also central to the company’s ability to grow larger and larger sapphire and be the first to market with large-diameter sapphire wafers for the LED and SoS/RFIC markets.  To date, Rubicon has shipped more than 400,000 6-inch wafers.

To read the full article, visit:   http://content.yudu.com/A2360p/CompSemMar13/resources/index.htm?referrerUrl=http%3A%2F%2Fwww.compoundsemiconductor.net%2Fcsc%2Fmagazine.php

Rubicon Ships 400,000th Large Diameter Sapphire Wafer

Two-inch, Four-inch and Six-inch Sapphire Wafers

Today, Rubicon Technology, Inc. (NASDAQ:RBCN) announced that they shipped their 400,000th six-inch large sapphire wafer to the LED manufacturing and SoS/RFIC markets. Most of the world’s LED manufacturing takes place using sapphire – just as computer chip makers like Intel and AMD use silicon to make their microprocessors.

The most flashy, if you’ll pardon the pun, market for sapphire wafers is in LEDs, which are used for energy-efficient general lighting and as the source for backlighting in consumer products such as HDTVs, laptops, smart phones and tablets.  A second and significantly growing market for sapphire is its use in Silicon-on-Sapphire (SoS) Radio Frequency Integrated Circuits (RFICs).  SoS RFIC chips deliver high RF performance with low power consumption, a small form factor, and significantly reduced crosstalk in antenna applications that are pervasive in smart phones and other consumer devices.

Why large diameter wafers? Rubicon began developing large diameter sapphire wafers for SoS RFICs in the 2000s.  But the company soon tapped into the larger opportunity in the LED market, especially with LED-based general lighting. And, it’s all about the math.

The market has been dominated by two-inch wafers for years. The surface area of a six-inch wafer is nine times greater than that of a two-inch wafer, and its outer curvature is less, enabling greater use of the surface area, culminating in a reduction in edge loss.  In addition, use of larger wafers enables operational savings that offset the cost of the larger, thicker substrate and can help drive down the total cost of LEDs.  According to Rubicon, and depending on the type of MOCVD reactor used, LED chip manufacturers using six-inch wafer platforms may achieve up to 48% greater usable area per reactor run compared with two-inch wafers.

What does that mean? Larger diameter wafers will help LED manufacturers reduce costs throughout the manufacturing process in order to make LED-based lighting more affordable for consumers and encourage adoption worldwide.

Further Reading

Rubicon Technology, Rubicon Technology Ships 400,000th Large Diameter Sapphire Wafer; Company Continues Market Leadership Supplying Large Diameter Sapphire Wafers to LED and SoS/RFIC Markets, http://bit.ly/1117AIk